首页> 外文期刊>ETRI journal >Digital Audio Effect System-on-a-Chip Based on Embedded DSP Core
【24h】

Digital Audio Effect System-on-a-Chip Based on Embedded DSP Core

机译:基于嵌入式DSP内核的数字音频效果片上系统

获取原文
       

摘要

This paper describes the implementation of a digital audio effect system-on-a-chip (SoC), which integrates an embedded digital signal processor (DSP) core, audio codec intellectual property, a number of peripheral blocks, and various audio effect algorithms. The audio effect SoC is developed using a software and hardware co-design method. In the design of the SoC, the embedded DSP and some dedicated hardware blocks are developed as a hardware design, while the audio effect algorithms are realized using a software centric method. Most of the audio effect algorithms are implemented using a C code with primitive functions that run on the embedded DSP, while the equalization effect, which requires a large amount of computation, is implemented using a dedicated hardware block with high flexibility. For the optimized implementation of audio effects, we exploit the primitive functions of the embedded DSP compiler, which is a very efficient way to reduce the code size and computation. The audio effect SoC was fabricated using a 0.18 μm CMOS process and evaluated successfully on a real-time test board.
机译:本文介绍了一种数字音频效果片上系统(SoC)的实现,该系统集成了嵌入式数字信号处理器(DSP)内核,音频编解码器知识产权,许多外围模块以及各种音频效果算法。音频效果SoC是使用软件和硬件协同设计方法开发的。在SoC的设计中,嵌入式DSP和一些专用硬件模块被开发为硬件设计,而音频效果算法则以软件为中心的方法来实现。大多数音频效果算法是使用具有在嵌入式DSP上运行的基本功能的C代码实现的,而均衡效果(需要大量计算)是使用具有高度灵活性的专用硬件模块实现的。为了优化音频效果,我们利用嵌入式DSP编译器的原始功能,这是减少代码大小和计算的非常有效的方法。音频效果SoC使用0.18μmCMOS工艺制造,并在实时测试板上成功评估。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号