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首页> 外文期刊>European Journal of Dentistry >Temperature Rise during Resin Composite Polymerization under Different Ceramic Restorations
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Temperature Rise during Resin Composite Polymerization under Different Ceramic Restorations

机译:不同陶瓷还原条件下树脂复合聚合过程中的温升

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Objectives:The purpose of this study was to measure temperature increase induced by various light polymerizing units during resin composite polymerization beneath one of three types of ceramic restorations.Methods:The resin composite (Variolink II) was polymerized between one of three different ceramic specimens (zirconium oxide, lithium disilicate, feldspathic) (diameter 5 mm, height 2 mm) and a dentin disc (diameter 5 mm, height 1 mm) with a conventional halogen light, a high intensity halogen light, or an LED unit. The temperature rise was measured under the dentin disc with a J-type thermocouple wire connected to a data logger. Ten measurements were carried out for each group. The difference between the initial and highest temperature readings was taken and the 10 calculated temperature changes were averaged to determine the mean value in temperature rise. Two way analysis of variance (ANOVA) was used to analyze the data (polymerizing unit, ceramic brand) for significant differences. The Tukey HSD test was used to perform multiple comparisons (α=.05).Results:Temperature rise did not vary significantly depending on the light polymerizing unit used (P=.16), however, the type of ceramic system showed a significant effect on temperature increases (P.05); in comparison, the resin composite polymerized under the zirconium oxide ceramic system induced a significantly lower temperature increase than the other ceramic systems tested (P<.05)Conclusions:The resin composite polymerized beneath zirconium oxide ceramic system induced significantly smaller temperature changes. The maximal temperature increase detected in all groups in this study was not viewed as critical for pulpal health.
机译:目的:本研究的目的是测量在三种类型的陶瓷修复物之一下树脂复合聚合过程中各种光聚合单元引起的温度升高。方法:树脂复合物(Variolink II)在三种不同的陶瓷样品之一之间聚合(氧化锆,二硅酸锂,长石(直径5毫米,高度2毫米)和牙本质盘(直径5毫米,高度1毫米),带有常规的卤素灯,高强度卤素灯或LED单元。在牙本质盘下用连接到数据记录器的J型热电偶线测量温度升高。每组进行十次测量。取初始温度读数和最高温度读数之间的差,并对10个计算出的温度变化取平均值,以确定温升的平均值。方差的双向分析(ANOVA)用于分析数据(聚合单元,陶瓷品牌)的显着差异。使用Tukey HSD测试进行了多次比较(α= .05)。结果:温度升高根据所使用的光聚合单元的不同而变化不大(P = .16),但是陶瓷体系的类型表现出显着的影响温度升高时(P.05);相比之下,在氧化锆陶瓷体系下聚合的树脂复合材料引起的温度升高明显低于其他测试的陶瓷体系(P <.05)。结论:在氧化锆陶瓷体系下聚合的树脂复合材料引起的温度变化小得多。在这项研究中,所有组中检测到的最大体温升高并不被认为对牙髓健康至关重要。

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