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The area–point constructal entransy dissipation rate minimization for a discrete variable cross-section conducting path

机译:离散变截面导电路径的面积点构造传递损耗最小化

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According to the constructal area–point heat conduction model, the thermal current in the high-conductive path increases only at conjunction points. If the optimum number of the lower order constructs which formed higher order constructs is finite, the number of the conjunction points is finite and the thermal current in the high-conductive path increases discretely. The cross-section of the high-conductive path should be adapted to the change of the thermal current through it. The area–point heat conduction problem is re-optimized based on entransy dissipation rate minimization using a discrete variable cross-section conducting path. The optimization process confirms that the mean temperature difference will decrease by resembling constructs which is expected by the constructal theory. Constructing the next assemble by a four optimization unit and making the high-conductive path cross-section scale by 2:1 will decrease the mean temperature difference regularly at an interval of two assembly levels, and the mean temperature difference will approach a constant. Optimization results show that the minimum mean temperature difference of the ninth assembly level decreases further by 2.84% compared with the optimization result without the premise of an optimized last-order construct.
机译:根据构造点-点热传导模型,高传导路径中的热电流仅在连接点处增加。如果形成高阶结构的低阶结构的最佳数目是有限的,则连接点的数目是有限的,并且高传导路径中的热电流会离散地增加。高传导路径的横截面应适合于通过它的热电流的变化。通过使用离散的可变横截面传导路径,使整个通道的耗散率最小化,可以重新优化面积点导热问题。优化过程证实,通过类似于构造理论所期望的构造,平均温差将减小。用四个优化单元构造下一个装配并将高导电路径横截面比例缩小为2:1,将以两个装配级别的间隔定期减小平均温度差,并且平均温度差将接近一个常数。优化结果表明,在没有优化最后顺序结构的前提下,第九个装配级的最小平均温差与优化结果相比进一步降低了2.84%。

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