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Effect of Reflow Profile Parameters on Surface Mount Chip Resistor Solder Joint Shear Strength

机译:回流曲线参数对表面贴装电阻器焊点剪切强度的影响

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The focus of this study is on the effect of reflow parameters on the joint shear strength. Eight reflow profiles were developed using four factors at two levels of Taguchi design of experiment for 1206, 0805 and 0603 chip resistors. Normal probability and main effect plots were used to provide a complete profile of the effect of reflow parameters on the chip resistor solder joint shear strength. The Normal Probability plots show effect of some reflow parameters on shear strength. Some data points did not fall on the best fit line.These outliers indicate parameter effects. The 1206 chip resistor shear strength value of 74.85N lies outside the best fit line indicating that some of the parameters are critical and significantly affect the response value. The results of the Main Effect plots help identify the unknown critical parameters in the probability plots. It indicates that the shear strength of 1206 chip resistor depends on the peak temperature, time above liquidus and preheat slope but not on cooling rate. In the case of the 0805 chip resistor, there were no exceptional departures from the line fitted to the data. It can be assumed that the factors and the levels considered here have no significant effect on the response. The normal probability plot of the 0603 chip resistor shows that the 46.68N shear strength lies outside the fitted line. This means that the factors and settings (run 3) can be further modified to improve the response. The factors which affected the 0603 resistor from the main effect plot are preheat slop and cooling rate.The results of the 1206 chip resistor show the highest shear force of 74.8 N using a peak temperature setting of 230°C (low level). The 0805 and 0603 chip resistors recorded the highest shear forces of 68.32N and 46.48 respectively using a temperature of 245°C (high level). The higher temperature may have contributed to the lower shear force due to the growth of brittle intermetallic compound in the case of the 0805 and 0603 chip resistors.
机译:这项研究的重点是回流参数对接头剪切强度的影响。在Taguchi设计的两个水平上,使用四个因子针对1206、0805和0603贴片电阻器开发了八个回流曲线。使用正态概率图和主效应图可提供回流参数对芯片电阻器焊点剪切强度的影响的完整曲线。正态概率图显示了一些回流参数对剪切强度的影响。一些数据点未落在最佳拟合线上,这些离群值表明参数的影响。 1206芯片电阻器的抗剪强度值为74.85N,位于最佳拟合线之外,表明某些参数很关键,并且会显着影响响应值。主效应图的结果有助于识别概率图中的未知关键参数。这表明1206贴片电阻器的剪切强度取决于峰值温度,液相线以上的时间和预热斜率,而不取决于冷却速率。对于0805片式电阻器,与数据线的匹配度没有任何异常。可以假定此处考虑的因素和水平对响应没有显着影响。 0603片式电阻器的正态概率图显示46.68N的剪切强度位于拟合线之外。这意味着可以进一步修改因子和设置(运行3)以改善响应。从主效应图中影响0603电阻器的因素是预热斜率和冷却速率.1206贴片电阻器的结果显示,在230°C的峰值温度设置(低电平)下,最大剪切力为74.8 N. 0805和0603贴片电阻器在245°C(高水平)的温度下记录的最高剪切力分别为68.32N和46.48。在0805和0603片式电阻器的情况下,由于脆性金属间化合物的生长,较高的温度可能导致较低的剪切力。

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