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Study on the Electrodeposition of Lead with In-Situ Ellipsometry

机译:原位椭圆法电沉积铅的研究

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摘要

In this study, we applied the in situ spectroscopic ellipsometry (SE) technology to the electrochemicaltest, and combined with cyclic voltammetry (CV) mainly researched underpotential-deposited (UPD)of Pb on polycrystalline Cu. The results showed the kinetics of UPD Pb on polycrytalline Cu was aquasi-reversible two dimensional nucleation and growth process, the reversible Pb UPD potential is50mV. The substrate solution interface structure was described with an effective mediumapproximation (EMA) model, and the volume fraction of Pb and solution were fitted. Fitting resultsshowed that double layer charge and hydrogen reduction reaction cannot be ignored.
机译:在这项研究中,我们将原位光谱椭圆仪(SE)技术应用于电化学测试,并与循环伏安法(CV)结合,主要研究了多晶Cu上Pb的欠电位沉积(UPD)。结果表明,UPD Pb在多晶铜上的动力学是准可逆的二维成核和生长过程,可逆的Pb UPD电位为50mV。用有效介质近似(EMA)模型描述了底物溶液的界面结构,并拟合了Pb和溶液的体积分数。拟合结果表明双层电荷和氢还原反应不容忽视。

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