Multi-physics Simulation of the Surface Polishing Effect During Electrochemical Machining

摘要

Electrochemical machining (ECM) is a widely used non-traditional machining technology. In additionto excellent shaping performance, ECM can generate a smooth surface finish. However, experimentalinvestigations into the surface polishing mechanism of ECM are extremely challenging. To understandthis microscale mechanism more deeply, we developed a novel multi-physics model for a numericalsimulation. The model accounts for the major factors involved in ECM, including the electric field, flowfield, ion transfer, electrode reaction kinetics, and anodic shape evolution. Based on this model, weinvestigated the effects of applied potential and flow speed on surface polishing. Furthermore, we studiedthe effect of the material's microstructure on surface polishing in ECM by setting position-dependentequilibrium potentials as boundary conditions. Our results show that the formation of an anodicsupersaturated film, which is affected by the applied potential and flow speed, plays an important rolein surface polishing.