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Study of the Hole-Formation Process with Different Mask Diameters via Through-Mask Electrochemical Machining

机译:掩膜式电化学加工不同掩模直径的成孔工艺研究

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Hole array structure components are widely used in the aviation industry and other industries. The plates used in such parts are thin, the number of holes is large, the arrangement is close, and the hole sizes are inconsistent. All these characteristics make the hole array structure components difficult to be fabricated in one process. The through-mask electrochemical machining technology has advantages in the machining of hole array structure components with difficult-to-machine materials. Suitable diameters of mask holes can be selected according to the size of the to-be-processed holes to complete the machining of hole array structure components. However, the appropriate choice of the mask diameter is still a problem. In this paper, based on the finite element model of through-mask electrochemical machining, simulations were conducted on the hole-formation process with five different mask diameters: 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, and 0.6 mm. The hole-formation rules with different mask diameters were then obtained. To prove the simulation rules, the corresponding experimental study was performed using a 0.2-mm Ni-based superalloy plate. The simulation rules were verified, and a relationship figure between the diameters of fabricated holes and the machining time was obtained. Suitable masks can be selected according to this figure to fabricate holes with required diameters.
机译:孔阵列结构组件广泛用于航空工业和其他行业。这些零件中使用的板薄,孔的数量大,布置紧密,并且孔的尺寸不一致。所有这些特性使得孔阵列结构部件难以在一个过程中制造。掩膜式电化学加工技术在加工难加工材料的孔阵列结构部件方面具有优势。可以根据待加工孔的尺寸选择合适的掩膜孔直径,以完成孔阵列结构件的加工。然而,掩模直径,选用合适的仍是一个问题。在本文中,基于通过掩模电化学加工的有限元模型,对具有五种不同掩模直径的孔形成过程进行了模拟:0.2 mm,0.3 mm,0.4 mm,0.5 mm和0.6 mm。然后获得具有不同掩膜直径的孔形成规则。为了证明模拟规则,使用0.2 mm的镍基高温合金板进行了相应的实验研究。验证了仿真规则,得到了加工孔直径与加工时间的关系图。可以根据该图选择合适的掩模,以制造具有所需直径的孔。

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