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Effect of Passivation Potential on Passive Behavior and Corrosion Resistance of Ni-Cu-P Amorphous Coating in Alkaline Solution

机译:钝化电位对碱性溶液中Ni-Cu-P非晶态涂层钝化行为和耐蚀性的影响

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Corrosion resistance and passive behavior of electroless Ni–Cu–P amorphous coating have been investigated in 10 wt.% NaOH solution by using electrochemical impedance spectroscopy, Mott– Schottky and X–ray photoelectron spectroscopy analysis. The result that the corrosion resistance is increased firstly and then exhibits an opposite trend with the increasing passive potential is resulted from the variation of passive film on the coating. Passive films formed at lower potential possess n– type and p–type bipolar semiconductors characteristics, but the passive films formed at higher potential have only p–type semiconductor characteristics. The thickness of passive films was increased with the increase of passive potential. The corrosion resistance of passivation films is combined affected by their thickness and their semiconductor type.
机译:通过电化学阻抗谱,Mott-Schottky和X射线光电子能谱分析,研究了在10 wt。%NaOH溶液中化学镀Ni-Cu-P无定形涂层的耐腐蚀性和钝化行为。涂层上钝化膜的变化导致了耐蚀性先增加然后呈相反趋势的趋势。以较低电势形成的钝化膜具有n型和p型双极半导体特性,但是以较高电势形成的钝化膜仅具有p型半导体特性。随着钝化电位的增加,钝化膜的厚度增加。钝化膜的耐蚀性受其厚度和半导体类型的影响。

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