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Three-dimensional stress-based topology optimization using SIMP method

机译:使用SIMP方法的基于应力的三维拓扑优化

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Structural topology optimization problems have been formulated and solved to minimize either compliance or weight of a design domain under volume or stress constraints. The introduction of three-dimensional analysis is a more realistic approach to many applications in industry and research, but most of the developments in stress-based topology optimization are two-dimensional. This article presents an extension of two-dimensional stress-based topology optimization into three-dimensional using SIMP method. The article includes a mathematical model for three-dimensional stress-based topology optimization problems and sensitivity analysis. The article also includes finite element analysis used to compute stress induced in the design domains. The developed model is validated using benchmark problems and the results are compared with three-dimensional compliance-based formulation. From the results, it was clear that the developed model can generate optimal topologies that can sustain applied loads under the boundary conditions defined.
机译:已经制定并解决了结构拓扑优化问题,以最大程度地减少体积或应力约束下设计领域的依从性或重量。三维分析的引入是在工业和研究中许多应用中更现实的方法,但是基于应力的拓扑优化的大多数发展都是二维的。本文介绍了使用SIMP方法将基于应力的二维拓扑优化扩展为三维的方法。本文包括一个基于三维应力的拓扑优化问题和灵敏度分析的数学模型。本文还包括用于计算设计域中引起的应力的有限元分析。使用基准问题验证了开发的模型,并将结果与​​基于三维合规性的公式进行了比较。从结果可以明显看出,开发的模型可以生成最佳拓扑,这些拓扑可以在定义的边界条件下承受施加的载荷。

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