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首页> 外文期刊>Indian Journal of Dental Research >A comparative evaluation of the shear bond strength of five different orthodontic bonding agents polymerized using halogen and light-emitting diode curing lights: An in vitro investigation
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A comparative evaluation of the shear bond strength of five different orthodontic bonding agents polymerized using halogen and light-emitting diode curing lights: An in vitro investigation

机译:卤素和发光二极管固化灯聚合的五种不同正畸粘合剂的剪切粘合强度的比较评估:体外研究

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Purpose: With the introduction of photosensitive (light-activated) restorative materials in orthodontics, various methods have been suggested to enhance the polymerization of the materials used, including use of more powerful light curing devices. Bond strength is an important property and determines the amount of force delivered and the treatment duration. Many light-cured bonding materials have become popular but it is the need of the hour to determine the bonding agent that is the most efficient and has the desired bond strength. Aim: To evaluate and compare the shear bond strengths of five different orthodontic light cure bonding materials cured with traditional halogen light and low-intensity light-emitting diode (LED) light curing unit. Materials and Methods: 100 human maxillary premolar teeth, extracted for orthodontic purpose, were used to prepare the samples. 100 maxillary stainless steel bicuspid brackets of 0.018 slot of Roth prescription, manufactured by D-tech Company, were bonded to the prepared tooth surfaces of the mounted samples using five different orthodontic bracket bonding light-cured materials, namely, Enlight, Fuji Ortho LC (resin-modified glass ionomer cement), Orthobond LC, Relybond, and Transbond XT. The bond strength was tested on an Instron Universal testing machine (model no. 5582). Results: In Group 1 (halogen group), Enlight showed the highest shear bond strength (16.4 MPa) and Fuji Ortho LC showed the least bond strength (6.59 MPa) (P value 0.000). In Group 2 (LED group), Transbond showed the highest mean shear bond strength (14.6 MPa) and Orthobond LC showed the least mean shear bond strength (6.27 MPa) (P value 0.000). There was no statistically significant difference in the shear bond strength values of all samples cured using either halogen (mean 11.49 MPa) or LED (mean 11.20 MPa), as the P value was 0.713. Conclusion: Polymerization with both halogen and LED resulted in shear bond strength values which were above the clinically acceptable range given by Reynolds. The LED light curing units produced comparable shear bond strength to that of halogen curing units.
机译:目的:随着牙齿矫正中引入光敏(光活化)修复材料,已提出了各种方法来增强所用材料的聚合,包括使用功能更强大的光固化设备。粘合强度是重要的属性,它决定了传递的力的大小和治疗的持续时间。许多光固化的粘结材料已经变得很流行,但是需要一个小时来确定最有效并具有所需粘结强度的粘结剂。目的:评估和比较使用传统卤素灯和低强度发光二极管(LED)光固化单元固化的五种不同的正畸光固化粘合材料的剪切粘合强度。材料和方法:使用100颗出于正畸目的提取的人类上颌前磨牙制备样品。使用五种不同的正畸托槽粘结光固化材料,即Enlight,Fuji Ortho LC(100),将D-tech公司制造的100个Roth处方的0.018槽上颌不锈钢双尖牙托粘结到准备好的样品的牙齿表面。树脂改性的玻璃离聚物水泥),Orthobond LC,Relybond和Transbond XT。在Instron Universal测试机(型号5582)上测试粘合强度。结果:在第1组(卤素组)中,Enlight的剪切粘结强度最高(16.4 MPa),Fuji Ortho LC的粘结强度最低(6.59 MPa)(P值0.000)。在第2组(LED组)中,Transbond的平均剪切粘结强度最高(14.6 MPa),而Orthobond LC的平均剪切粘结强度最低(6.27 MPa)(P值0.000)。由于P值为0.713,使用卤素(平均11.49 MPa)或LED(平均11.20 MPa)固化的所有样品的剪切粘结强度值在统计学上均无显着差异。结论:卤素和LED的聚合反应产生的剪切粘合强度值超过了雷诺给出的临床可接受范围。 LED光固化单元产生的剪切粘合强度与卤素固化单元相当。

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