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A 128 Kb HfO2 ReRAM with Novel Double-Reference and Dynamic-Tracking scheme for write yield improvement

机译:具有新型双参考和动态跟踪方案的128 Kb HfO2 ReRAM,可提高写入良率

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References(18) A 128 Kb HfO2 Resistive Random Access Memory (ReRAM) chip is developed based on HHNEC 0.13 μm 1P8M CMOS process. ReRAM is suffering the write yield problem due to the tail-bit issues and large resistance variations at high temperature. In this paper a novel Double-Reference and Dynamic-Tracking Write (DR-DTW) scheme and a Dynamic read scheme are proposed to fix these issues. The experiment results show that the tail-bit issues are almost eliminated and the write yield is improved greatly compared with traditional write scheme.
机译:参考文献(18)基于HHNEC 0.13μm1P8M CMOS工艺开发了128 Kb HfO2电阻随机存取存储器(ReRAM)芯片。由于尾位问题和高温下的大电阻变化,ReRAM遭受了写良率问题。本文提出了一种新颖的双参考和动态跟踪写入(DR-DTW)方案和一个动态读取方案来解决这些问题。实验结果表明,与传统的写方案相比,几乎消除了尾位问题,提高了写良率。

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