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Fabrication of Cu-Based SiC Composites by Spark Plasma Sintering of Cu-Nitrate Coated SiC Powders

机译:硝酸铜包覆的SiC粉的放电等离子体烧结制备Cu基SiC复合材料

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An optimum route to fabricate the Cu-based SiC composites with homogeneous microstructure was investigated. Three methods for developing the densified composites with sound interface between Cu and SiC were compared on the basis of the resulting microstructures. Starting with three powder mixtures of elemental Cu and SiC, elemental Cu and PCS coated SiC or PCS and Cunitrate coated SiC was used to obtain Cu-based SiC composites. SEM analysis revealed that the composite fabricated by spark plasma sintering using elemental SiC and Cu powder mixture showed inhomogeneous microstructure. Conversely, dense microstructure with sound interface was observed in the sintered composites using powder mixture of pre-coated PCS and Cu-nitrate onto SiC. The relationship between powder processing and microstructure was discussed based on the role of coating layer for the wettability
机译:研究了制备具有均匀微观结构的Cu基SiC复合材料的最佳途径。在所得的微观结构的基础上,比较了三种开发在铜和碳化硅之间具有良好界面的致密复合材料的方法。从元素铜和SiC的三种粉末混合物开始,使用元素铜和PCS涂层的SiC或PCS和Craterate涂层的SiC来获得Cu基SiC复合材料。 SEM分析表明,采用元素SiC和Cu粉末混合物通过火花等离子体烧结制备的复合材料显示出不均匀的微观结构。相反,使用预涂PCS和硝酸铜在SiC上的粉末混合物在烧结复合材料中观察到了具有良好界面的致密微观结构。基于涂层对润湿性的作用,探讨了粉末加工与微观结构之间的关系。

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