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首页> 外文期刊>AIP Advances >Investigation of trap states in high Al content AlGaN/GaN high electron mobility transistors by frequency dependent capacitance and conductance analysis
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Investigation of trap states in high Al content AlGaN/GaN high electron mobility transistors by frequency dependent capacitance and conductance analysis

机译:通过频率依赖性电容和电导分析研究高Al含量的AlGaN / GaN高电子迁移率晶体管中的陷阱态

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Trap states in Al0.55Ga0.45N/GaN Schottky-gate high-electron-mobility transistors (S-HEMTs) and Al2O3/Al0.55Ga0.45N/GaN metal-oxide-semiconductor HEMTs (MOS-HEMTs) were investigated with conductance method in this paper. Surface states with time constant of (0.09–0.12) μs were found in S-HEMTs, and electron tunneling rather than emission was deemed to be the dominant de-trapping mechanism due to the high electric field in high Al content barrier. The density of surface states evaluated in S-HEMTs was (1.02–4.67)×1013 eV?1·cm?2. Al2O3 gate insulator slightly reduced the surface states, but introduced low density of new traps with time constant of (0.65–1.29) μs into MOS-HEMTs.
机译:采用电导法研究了Al0.55Ga0.45N / GaN肖特基栅高电子迁移率晶体管(S-HEMT)和Al2O3 / Al0.55Ga0.45N / GaN金属氧化物半导体HEMT(MOS-HEMT)中的陷阱态在本文中。在S-HEMT中发现时间常数为(0.09–0.12)μs的表面态,由于高Al含量势垒中的高电场,电子隧穿而不是发射被认为是主要的去俘获机理。在S-HEMTs中评估的表面态密度为(1.02-4.67)×1013 eV?1·cm?2。 Al2O3栅绝缘体略微降低了表面状态,但在MOS-HEMT中引入了低密度的新陷阱,其时间常数为(0.65-1.29)μs。

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