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Preparation, structural and thermal studies of boroxine adducts having aryl boronic acids and pyrazoles

机译:具有芳基硼酸和吡唑的环硼氧烷加合物的制备,结构和热研究

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Four new boroxine adducts ((B3O3(Ph)3PzH) (1), (B3O3(Ph)3(PztBu,iPrH)2) (2), (B3O3(PhF2)3PzH). PzH (3) and (B3O3(PhF2)3(PztBu,iPrH)2) (4)) using phenylboronic acid, 3,5-difluorophenylboronic acid, 1H-pyrazole (PzH) and 3-tert-butyl-5-isopropyl pyrazole (PztBu,iPrH) were prepared and characterized by elemental analysis, IR, 1H-NMR and X-ray diffraction. The crystallographic study reveals that PzH and PztBu,iPrH are bonded to boroxine molecule through B-N dative bond. It also demonstrates the different type of hydrogen bond interactions between adjacent molecules. The thermal stability of these adducts was investigated by TGA.
机译:四个新的环硼氧烷加合物((B3O3(Ph)3PzH)(1),(B3O3(Ph)3(PztBu,iPrH)2)(2),(B3O3(PhF2)3PzH).PzH(3)和(B3O3(PhF2)使用苯基硼酸,3,5-二氟苯基硼酸,1H-吡唑(PzH)和3-叔丁基-5-异丙基吡唑(PztBu,iPrH)制备)3(PztBu,iPrH)2)(4))通过元素分析,IR,1H-NMR和X射线衍射分析。晶体学研究表明,PzH和PztBu,iPrH通过B-N导数键与环硼氧烷分子键合。它还证明了相邻分子之间氢键相互作用的不同类型。通过TGA研究这些加合物的热稳定性。

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