Comparison of methods for broadband electromagnetic characterization of Molded Interconnect Device materials

摘要

Combining the Molded Interconnect Device technology with the Laser DirectStructuring technology exhibits the potential of designing electrical andmechanical components on three-dimensional surfaces to increasefunctionality, level of integration and to reduce costs. When takingadvantage of this technology especially in the design of RF devices, aprecise knowledge of the electromagnetic parameters of the MID material isrequired, as the complex permeability and permittivity strongly influence thedevice performance. At present time, these materials are notelectromagnetically characterized in the RF frequency range. In this paperdifferent methods are therefore presented and compared with respect to theirpotentials for broadband electromagnetic characterization of MoldedInterconnect Device materials.