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Experimental and numerical analysis on PCB coupling in non uniform field environment

机译:非均匀电场环境下PCB耦合的实验与数值分析

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摘要

HPM and UWB pulses are capable of disruptingsignal processing or even destroying semiconductor structures.Hence, it is useful to estimate the induced voltage levelson printed circuit boards (PCB) in response to differentexcitation signals. The considered PCB is integrated withina missile-like cylindrical structure, called GENEC, and isequipped with differential sensors to measure the E- and Hfieldabove the PCB. Standard transmission line theory is appliedto develop a SPICE model that calculates the terminalvoltages at the transmission line loads.
机译:HPM和UWB脉冲能够破坏信号处理甚至破坏半导体结构。因此,响应于不同的激励信号来估计印刷电路板(PCB)上的感应电压电平非常有用。所考虑的PCB与称为GENEC的类似导弹的圆柱形结构集成在一起,并配有差分传感器以测量PCB上方的E和H场。应用标准传输线理论来开发SPICE模型,该模型可计算传输线负载下的端电压。

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