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Determining a Failure Root Cause Distribution From a Population of Layout-Aware Scan Diagnosis Results

机译:从大量可识别布局的扫描诊断结果中确定故障根源分布

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摘要

The yield of an integrated circuit (IC) is well known to be a critical factor in the success of an IC in the market place. Achieving high stable yields helps ensure that the product is profitable and meets quality and reliability objectives. When a new manufacturing process is introduced, or a new product is introduced on a mature manufacturing process, yields will tend to be significantly lower than acceptable. The ability to meet profitability and quality objectives, and perhaps more importantly, time-to-market and time-to-volume objectives depend greatly on the rate at which these low yields can be ramped up. While the yield ramp depends on both the yield learning and yield enhancement cycle times, this work focuses on significantly increasing the value of test data and the yield learning rate.
机译:众所周知,集成电路(IC)的产量是IC在市场上成功的关键因素。实现高稳定的产量有助于确保产品盈利并达到质量和可靠性目标。当采用新的制造工艺或在成熟的制造工艺中引入新产品时,成品率往往会大大低于可接受的水平。达到利润率和质量目标的能力,也许更重要的是,上市时间和批量生产时间目标在很大程度上取决于提高这些低产量的速度。良率上升取决于良率学习和良率增强循环时间,但这项工作着重于显着提高测试数据的价值和良率学习率。

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