首页> 外文期刊>Corrosion science >Corrosion inhibitor embedded spherical micro-pits fabricated using cetyltrimethyl ammonium bromide as etching template for self-healing corrosion protection
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Corrosion inhibitor embedded spherical micro-pits fabricated using cetyltrimethyl ammonium bromide as etching template for self-healing corrosion protection

机译:以十六烷基三甲基溴化铵为腐蚀模板制备的缓蚀剂嵌入式球形微坑,用于自修复腐蚀防护

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摘要

In this study, a self-healing system is composed of spherical micro-pits layer storing inhibitor and epoxy layer for physical shielding. The spherical micro-pits were fabricated in a copper substrate via HNO_3 etching technique with the assistance of cetyltrimethyl ammonium bromide (CTAB) and ultrasonication. By means of localized electrochemical measurements, significant inhibition of corrosion activity can be observed in the scratched area. After being scratched, the self-healing system rapidly releases the inhibitor embedded in the spherical micro-pits to resist the corrosion process. The exposed copper is covered with an inhibitor adsorption film and protected effectively.
机译:在这项研究中,一个自修复系统由球形微坑层和缓蚀剂层组成,球形微坑层中存有抑制剂和用于物理屏蔽的环氧层。在十六烷基三甲基溴化铵(CTAB)的辅助下,通过HNO_3刻蚀技术在铜基片上制作球形微坑。通过局部电化学测量,可以在划痕区域观察到对腐蚀活性的显着抑制。刮擦后,自修复系统会迅速释放嵌入球形微坑中的抑制剂,以抵抗腐蚀过程。裸露的铜被抑制剂吸附膜覆盖并得到有效保护。

著录项

  • 来源
    《Corrosion science》 |2014年第11期|444-451|共8页
  • 作者单位

    Department of Materials Science and Chemical Engineering, School of Chemical Engineering, Dalian University of Technology, 2 Linggong Road, Dalian 116024, China;

    Department of Materials Science and Chemical Engineering, School of Chemical Engineering, Dalian University of Technology, 2 Linggong Road, Dalian 116024, China;

    Department of Materials Science and Chemical Engineering, School of Chemical Engineering, Dalian University of Technology, 2 Linggong Road, Dalian 116024, China;

    Department of Materials Science and Chemical Engineering, School of Chemical Engineering, Dalian University of Technology, 2 Linggong Road, Dalian 116024, China;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    A. Copper; B. SEM; B. EIS; C. Passive film;

    机译:A.铜;扫描电镜B.EIS;C.被动膜;

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