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The v2.0+EDR Bluetooth SOC architecture for multimedia

机译:多媒体v2.0 + EDR蓝牙SOC架构

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This paper presents a Bluetooth system on chip (SOC) architecture for multimedia applications. The SOC includes all necessary baseband-parts, RF-parts, a sub-band codec (SBC) and an application processor to achieve a Bluetooth specification v2.0+EDR (enhanced data rate). Dual bus architecture is selected to improve data transmission efficiency between a baseband and a system bus. The receiver uses an optimized low-IF (1.5 MHz) architecture which is trade-off between power and performance on CMOS technology. The transmitter uses a direct up conversion architecture. This chip occupies a die size of 28 mm/sup 2/ in a 0.18 /spl mu/m CMOS. This chip and a flash memory are put into multi chip package (MCP). The maximum current consumption of the total chip is 65 mA at the TX mode. The internal supply voltages of RF- and digital-parts are 1.8 V. First measurement results meet most of the Bluetooth specification v2.Q+EDR and show the suitability of the presented single-chip concept.
机译:本文提出了一种用于多媒体应用的蓝牙片上系统(SOC)架构。 SOC包括所有必需的基带部分,RF部分,子带编解码器(SBC)和应用处理器,以实现蓝牙规范v2.0 + EDR(增强的数据速率)。选择双总线体系结构以提高基带和系统总线之间的数据传输效率。该接收器使用优化的低中频(1.5 MHz)架构,该架构在CMOS技术的功率和性能之间进行权衡。发送器使用直接上变频架构。在0.18 / spl mu / m CMOS中,该芯片的管芯尺寸为28 mm / sup 2 /。将该芯片和闪存放入多芯片封装(MCP)中。在TX模式下,整个芯片的最大电流消耗为65 mA。 RF和数字部分的内部电源电压为1.8V。首次测量结果符合大多数蓝牙规范v2.Q + EDR,并显示了所提出的单芯片概念的适用性。

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