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Hybridization of hexagonal boron nitride nanosheets and multilayer graphene: Enhanced thermal properties of epoxy composites

机译:六边形氮化硼纳米片和多层石墨烯的杂交:环氧复合材料的增强热性能

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摘要

We report an effective and reproducible method for hybridization of surface modified hexagonal boron nitride (h-BNNS) and multilayer graphene (MLG) by silane coupling agents. Simultaneously, silver (Ag) nanoparticles were grown on the interface of hybrid filler as a bridging agent during the hybridization process that activates free transportation of phonons when incorporated with epoxy matrix. Hybridization of surface modified h-BNNS and MLG improved the interfacial properties and the dispersion of the filler in the epoxy matrix. The hybrid filler BNNS-Ag-MLG (H-BSG) incorporated in the epoxy matrix and characterized for thermal properties. The thermal analysis confirmed that exceptionally improved thermal conductive and excellent thermally stable epoxy composite was fabricated. It was found that similar to 26 folds improvement in in-plane thermal conductivity was recorded by addition of 10 wt % of H-BSG in comparison with neat epoxy. This study indicates a step towards developing a strong interfacial connection between MLG and h-BNNS to make effective hybrid filler and emerging candidate for thermal interface applications.
机译:我们通过硅烷偶联剂报告了一种有效且可重复的方法,用于通过硅烷偶联剂杂交表面改性六方氮化物(H-BNN)和多层石墨烯(MLG)的杂交。同时,在杂交填料的杂交填料界面上生长银(Ag)纳米颗粒在杂交过程中掺入掺入环氧基质时激活声子的自由运输。表面改性的H-BNN和MLG的杂交改善了填充物在环氧基质中的界面性质和分散体。掺入环氧基质中的杂交填料BNNS-Ag-MLG(H-BSG)并表征热性质。热分析证实,制造了异常改善的导热和优异的热稳定环氧复合材料。发现与整齐的环氧树脂相比,通过添加10wt%的H-BSG来记录与面内导热率相似的26倍。该研究表明,迈向MLG和H-BNN之间强大界面连接的步骤,以使有效的杂交填料和热界面应用的新兴候选者。

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