Embedding versus adhesive bonding of adapted piezoceramic modules for function-integrative thermoplastic composite structures

摘要

Against the background of an integration of piezoceramic modules into thermoplastic composite structures the development of thermoplastic-compatible piezoceramic modules (TPM) requires the consideration of the type of module-structure-connection and module position for an optimal strain transmission. While commercially available low profile transducers are applied predominantly by adhesive bonding, TPM with thermoplastic carrier films identical to the thermoplastic matrix of the composite structure offer the possibility for a material-homogeneous integration by a hot-pressing process. The aim of the presented work is to examine the influence of an adhesive layer as well as the comparison of adhesive bonding and module integration by a hot-pressing process. Therefore a common analytic model and the finite element method (FEM) is used. Particular regard is given to a maximum strain transmission between the functional module and the composite structure. For pure bending as well as for pure linear expansion the studies show the advantages of a material-homogeneous integration of function modules.