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Bonding sensor based on simplified Fiber Bragg Grating spectral evolution

机译:基于简化的光纤布拉格光栅光谱演化的键合传感器

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摘要

A new bonding sensor for composite material manufacturing based on a single uniform Fiber Bragg Grating (FBG) is proposed and demonstrated in this paper. The sensor design includes two edge sections attached to the bonded parts and a central free region, all made of an epoxy resin block of constant thickness, where the FBG is embedded. The quality of this bond is quantified by measuring the FBG spectral evolution. The strain transfer from the sensor to the embedded fiber allows to distinguish between two typical bonding defects in composite structures: asymmetric deformation and slide of bonded parts. Both cases have been experimentally checked and the results are in good agreement with simulations based on a simplified model using the Finite Elements Analysis (FEA) and Transfer Matrix methods, even under complex deformations.
机译:提出并演示了一种基于单一均匀光纤布拉格光栅(FBG)的用于复合材料制造的新型粘合传感器。传感器设计包括两个边缘部分,这些边缘部分连接到结合的部分和一个中央自由区域,全部由恒定厚度的环氧树脂块制成,并嵌入FBG。该键的质量通过测量FBG光谱演化来量化。从传感器到嵌入光纤的应变传递可以区分复合结构中的两个典型粘结缺陷:不对称变形和粘结零件的滑动。两种情况都经过了实验检查,结果与基于简化模型的有限元分析(FEA)和传递矩阵方法(基于复杂模型)的仿真结果非常吻合。

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