Integrating and Interfacing Flexible Electronics in Hybrid Large-Area Systems

摘要

An approach to creating large-area systems is described that combines flexible thin-film electronic sensor surfaces with complementary metal–oxide–semi–conductor (CMOS) integrated circuits (ICs). Complete systems are built by lamination of multiple layers, consisting of thin-film subsystems and CMOS ICs on a passive flexible substrate. A flexible passive backplane provides in-plane interconnections. Via-type interconnections between stacked layers are made by inductive or capacitive coupling. Steps and testing techniques, from devices and circuits to fully integrated hybrid systems, are illustrated.