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首页> 外文期刊>Components, Packaging and Manufacturing Technology, IEEE Transactions on >Variations in Micromachined Isolator Geometries for Sensor Performance in Harsh Environments
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Variations in Micromachined Isolator Geometries for Sensor Performance in Harsh Environments

机译:微机械隔离器几何的变化在恶劣环境中的传感器性能

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This article details the design, simulation, fabrication, and testing of four variations of micromachined vibration isolators. The vibration isolators serve as low-pass filters to attenuate high-frequency (>2 kHz) mechanical excitation in order to improve both microelectromechanical system (MEMS) sensor fidelity and lifespan. Isolators are designed for integration with a small (similar to 3 mmx similar to 3 mm) MEMS sensor package and boast a sub-1-cm(2) footprint (7 mm x 7 mm). For all isolator variations, the fundamental geometry consists of an outer frame to be fixed to the substrate of interest, a central platform to accommodate the isolated sensor, and springs for the attachment of the frame and platform. We fabricate devices via a simple, double-sided lithography process using < 100 > silicon-on-insulator (SOI) wafers. We then performed laser Doppler vibrometry to investigate the frequency response of each isolator variation across a 6.2-kHz bandwidth. Dependent upon geometry, isolator variations exhibit resonant frequencies from 1.3 to 2 kHz with quality factors ( Q's) ranging from 16.7 to 60.
机译:本文详细介绍了微机械隔离器四种变体的设计,仿真,制造和测试。隔振器用作低通滤波器,以衰减高频(> 2 kHz)机械激发,以改善微机电系统(MEMS)传感器保真和寿命。隔离器设计用于与小(类似于3mmx类似于3 mm)MEMS传感器封装的集成,并吹动了亚1-cm(2)占地面积(7mm x 7 mm)。对于所有隔离器变化,基本几何形状由外框架固定到感兴趣的基板,一个用于容纳隔离传感器的中心平台,以及弹簧用于框架和平台的安装。我们通过使用<100>硅 - 镶嵌晶片(SOI)晶片来制造通过简单的双面光刻工艺进行制造设备。然后,我们执行了激光多普勒振动器,以研究6.2-kHz带宽的每个隔离器变化的频率响应。依赖于几何形状,隔离器变化具有从1.3到2kHz的谐振频率,质量因子(Q的)范围为16.7至60。

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