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Cost-effective fab-capacity expansion

机译:具有成本效益的晶圆厂产能扩展

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With the semiconductor industry upturns and downturns occurring more frequently, capacity planning becomes a difficult task, Greenfield expansions can take 18 months or more to put capacity in place, and fab expansions can take up to 12 months. As an alternative, fab upgrades can put capacity on line in as little as three months with an attractive return on in-vestment (ROI). ROI analyses show that investing in a Standard Mechanical Interface (SMIF)-based upgrade to an existing 200-mm fabrication facility is competitive with adding tools, upgrading deanroom space and other methods used to increase the number of wafers per month run through an existing fab. Keep in mind that in the SMIF-based option, "upgrade" should not be read as "helping older process technology keep up." Increasingly, ROI analyses for SMIF show that these upgrades make the most sense for large die and challenging technology nodes. In fact, our market research shows that some of the largest opportunities in the industry for SMIF upgrades are for 130-nm node technology and above (see Figure 1, page 23).
机译:随着半导体行业的好转和低迷更加频繁,产能计划已成为一项艰巨的任务,扩建绿地可能需要18个月或更长时间才能实现产能,而晶圆厂的扩建可能会长达12个月。作为替代方案,晶圆厂升级可以在短短三个月内使产能投入生产,并获得可观的投资回报(ROI)。 ROI分析表明,投资于基于标准机械接口(SMIF)的现有200毫米制造工厂的升级与增加工具,升级除尘室空间以及其他用于增加现有工厂每月增加晶圆数量的方法相比具有竞争力。请记住,在基于SMIF的选项中,“升级”不应理解为“帮助保持较旧的工艺技术”。 SMIF的ROI分析越来越表明,这些升级对于大型裸片和具有挑战性的技术节点最有意义。实际上,我们的市场研究表明,SMIF升级行业中最大的机会是130纳米及以上节点技术(请参见第23页的图1)。

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