Double-Sided Mirror-Imaged BGA Assembly

摘要

The need for smaller, lighter, faster and cheaper products drives new and innovative packaging and interconnect schemes to meet cost requirements without compromising product performance. Ball-grid array (BGA) packages have become a preferred option for applications requiring more than 300 interconnects. BGAs provide higher interconnect density while mitigating assembly problems associated with QFPs (quad flat packs). Today, PCB assemblies with multiple BGA devices of greater than 600 I/Os are mass-produced, with less than 15 defects/ppm (parts per million) assembly defects.2 Beyond BGAs, chip-scale packages (CSPs) and direct chip attach (DCA) interconnects, are probably the next steps in the technology roadmap of electronics packaging. Despite the density and performance benefits they provide, CSP and DCA technologies need to be cost effective with matured support infrastructure before they will become common interconnect options.