Understencil Cleaning for Process Repeatability

摘要

Understencil cleaning is essential if a process is to be repeatable. Excessive cleaning, on the other hand, will slow throughput unnecessarily. SPC tools can help optimize the frequency, but this frequency is increasing as aperture dimensions diminish and Pb-free pastes display poorer release characteristics. Hence, faster understencil cleaning techniques are required to maintain high throughput at cleaning rates optimal for the latest generation stencil-and-paste combinations.