MICRDVIA DRILLING BENEFITS FROM NEW Q-SWITCHED CO_2 LASER TECHNOLOGY

摘要

New technologies must be developed for high-density via formation. One technology, a Q-switched RF-excited waveguide CO_2 laser, promises to increase via drilling output with its high-repetition rate performance. Even in the current economic slowdown, consumers' considerable demand for cheaper, smaller, lighter, and more powerful electronics continues to drive the need for more compact HDI structures with microvias that are the backbones of these devices. PWBs are now being designed to accept chips with even smaller dimensions while input/output requirements continue to grow. As the economy picks up speed the industry's constant drive to push chips and associated circuits towards even smaller sizes will regain urgency. Via densities will continue to grow, to support higher-density interconnections. The requirement to reliably produce higher density microvias at faster speeds however is only part of the issue. Microvias must also be produced inexpensively in order to facilitate less expensive HDI PWBs. Therefore, new, cost effective technologies have to be developed in order to keep up with the demands of high-density via formation. One such new technology, a Q-switched RF-excited waveguide CO_2 laser promises to increase via drilling output with its high-repetition rate performance.