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PCQR~2 Industry Statistics: Soldermask Registration

机译:PCQR〜2行业统计:阻焊剂注册

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摘要

The Industry Statistics (Ref. 1), a summary of information collected by the IPC Printed Board Process Capability, Quality, and Relative Reliability (PCQR~2) Benchmark Test Standard and Database (Ref. 2), illustrates the capability, quality, and reliability of the PCB industry. Previous columns introduced the industry statistics, and presented results from outerlayer conductors and spaces, half-ounce and 1-ounce innerlayer conductors and spaces, and through vias. This column presents the results from soldermask registration. The results are the summary of 29 submissions to the database, which include data from ten medium-technology 0.062" 6-layer designs, five high-technology 0.062" 12-layer designs, two medium-technology and two high-technology 0.093" 18-layer designs, and ten high-technology 0.125" 24-layer designs. There are eight submissions from North America, two from Europe, and 19 from Asia.
机译:IPC印刷电路板过程能力,质量和相对可靠性(PCQR〜2)基准测试标准和数据库(参考文献2)收集的信息摘要《行业统计数据》(参考文献1)说明了能力,质量和PCB行业的可靠性。前面的专栏文章介绍了行业统计数据,并介绍了外层导体和间隔,半盎司和1盎司内层导体和间隔以及过孔的结果。此列显示了阻焊剂注册的结果。结果是数据库中29项提交的摘要,其中包括来自十个中等技术的0.062“ 6层设计,五个高科技的0.062” 12层设计,两个中等技术和两个高科技0.093“ 18的数据层设计和十个高科技0.125英寸24层设计。北美提交了八份意见书,欧洲提交了两份意见书,亚洲提交了十九份意见书。

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