It has been demonstrated that environmental influences, i.e. temperature and humidity can clearly have an impact on the dielectric constant (D_k) and dissipation factor (D_f) on various board materials. The impact on D_f is of specific interest when considering backplane applications. Early SERDES for high speed serial links forced system designers to minimize trace skin effect and dielectric losses in order to establish acceptable link integrity. The focus on skin effect and dielectric losses combined with the relatively low speeds limited the industry's vision in understanding the true nature of the channel.
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