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Back to Basics Part 22 - Design Features for Flexible Circuit Coatings

机译:返璞归真第22部分-柔性电路涂层的设计功能

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摘要

Those who read the last installment of this series will recall it was focused on flexible circuit coatings, which included: cover layers, cover costs, and cover films. There is inevitably a need to access features through the coating regardless of the type used, and this topic was discussed earlier in some detail for both surface mount land design and through-hole component terminations. The sizing of cover-layer openings will, of course, vary in accord with pad design features and the presence or absence of a plated through-hole structure associated with the termination. As before, the key area of concern relative to termination access design features in the flex circuit is with single metal layer flex circuits. The primary concern is related to the possibility of pad lift during assembly or use, and, with the elevated temperatures of lead free, the problem is a more urgent concern than just a few short years ago.
机译:那些阅读了该系列最后一部分的人会记得,该系列专注于柔性电路涂层,包括:覆盖层,覆盖成本和覆盖膜。无论使用哪种类型,都不可避免地需要通过涂层访问特征,并且前面已针对表面贴装焊盘设计和通孔元件端接对此主题进行了详细讨论。当然,覆盖层开口的尺寸将根据焊盘设计特征以及与端子相关的镀通孔结构的存在或不存在而变化。如前所述,与柔性电路中的终端访问设计特征相关的关键问题在于单金属层柔性电路。主要问题与组装或使用过程中焊盘抬起的可能性有关,并且随着无铅温度的升高,该问题比几年前更加紧迫。

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