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Implementation of the RoHS directive and compliance implications for the PCB sector

机译:RoHS指令的实施以及对PCB部门的合规性影响

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摘要

Purpose - To present an overview of the current status of the RoHS directive and its implications for the printed circuit board (PCB) industry. Design/methodology/approach - A review paper detailing the requirements of the RoHS directive, the materials that are proscribed, where they are found and the impacts on PCB fabrication and assembly. Findings - The main implications of RoHS for the PCB industry are related to the proscription of lead and the move to lead-free assembly. Tin-lead HASL finished boards will no longer be allowed and new laminates may be needed to accommodate the higher soldering temperatures associated with lead-free assembly. There is growing pressure to move away from the use of brominated flame retardants, even though the standard materials used in FR4 type laminates are not proscribed. Research limitations/implications - Manufacturers need to be aware of the implications of the RoHS directive, not just in terms of compliance but also from a materials selection and reliability perspective. Originality/value - The paper details how the RoHS directive impacts PCB manufacturing and assembly and highlights the changes needed to enable reliable lead-free assembly within the context of legislative compliance. Actions necessary to ensure compliance are also detailed.
机译:目的-概述RoHS指令的当前状态及其对印刷电路板(PCB)行业的影响。设计/方法/方法-一份审查文件,详细说明RoHS指令的要求,所规定的材料,发现的位置以及对PCB制造和组装的影响。研究结果-RoHS对PCB行业的主要影响与铅的使用以及向无铅组装的转变有关。不再允许使用锡铅HASL成品板,并且可能需要新的层压板来适应与无铅组装相关的更高焊接温度。即使不禁止使用FR4型层压板中的标准材料,也要摆脱使用溴化阻燃剂的压力越来越大。研究局限性/含义-制造商需要意识到RoHS指令的含义,不仅是在合规性方面,而且还应从材料选择和可靠性的角度出发。原创性/价值-本文详细介绍了RoHS指令如何影响PCB的制造和组装,并着重强调了在法规合规的背景下实现可靠​​的无铅组装所需要的更改。还详细介绍了确保合规性所需采取的措施。

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