P~3T - a new technology for the cost and resource efficient inline production of flexible printed circuits, RFID antennas and biosensors

摘要

Purpose - The purpose of this paper is to present details of the plasma printing and packaging technology (P~3T), a new reel-to-reel technology underrndevelopment for the cost and resource efficient manufacture of flexible printed circuits (FPC).rnDesign/methodology/approach - The first two process steps of P~3T include reel-to-reel patterned activation of polymer film at ambient pressure inrnthe so-called plasma-printing process and subsequent selective electroless plating of the plasma-activated areas of the polymer film. The conceptrnunderlying the P~3T project includes processing of flexible films with widths up to 400 mm.rnFindings - Copper, palladium and nickel metal structures with widths down to less than 100 μm were produced on various polymers. Peel strengthsrnaccording to the German DIN Standard 53494 of copper on polyimide film reached values in the region of 1 N/mm, sufficient for electronic applications.rnSufficient wetting of the solder on copper metallisations and solderability were found.rnResearch limitations/implications - P~3T covers the whole manufacturing chain for FPCs from surface patterning of the dielectric carrier to componentrnassembly and soldering. This paper focuses, however, essentially on the first two process steps including plasma activation and electroless plating.rnOriginality/value - A unique feature of the flexible circuit manufacturing technology presented here is the combination of the additive-technique, thernabsence of vacuum processes, the continuous production mode and the ability to process polymer carrier films with widths of 400 mm.