Morphology and acoustic artefacts of copper deposits electroplated using megasonic assisted agitation

Jones Thomas D. A.; Flynn David; Desmulliez Marc P. Y.; Price Dennis; Beadel Matthew; Strusevich Nadia; Patel Mayur; Bailey Chris; Costello Suzanne

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Morphology and acoustic artefacts of copper deposits electroplated using megasonic assisted agitation

机译：超声辅助搅拌电镀铜沉积物的形貌和声学伪像

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Purpose - This study aims to understand the influence of megasonic (MS)-assisted agitation on printed circuit boards (PCBs) electroplated using copper (Cu) electrolyte solutions to improve plating efficiencies through enhanced ion transportation.

机译：目的-这项研究旨在了解兆速（MS）辅助搅拌对使用铜（Cu）电解质溶液电镀的印刷电路板（PCB）的影响，以通过增强离子传输来提高电镀效率。

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来源
《Circuit World》 |2016年第3期|127-140|共14页
作者
Jones Thomas D. A.; Flynn David; Desmulliez Marc P. Y.; Price Dennis; Beadel Matthew; Strusevich Nadia; Patel Mayur; Bailey Chris; Costello Suzanne;
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作者单位

Heriot Watt Univ, Res Inst Signals Sensors & Syst, Microsyst Engn Ctr, Sch Engn & Phys Sci, Edinburgh, Midlothian, Scotland;

Heriot Watt Univ, Res Inst Signals Sensors & Syst, Microsyst Engn Ctr, Sch Engn & Phys Sci, Edinburgh, Midlothian, Scotland;

Heriot Watt Univ, Res Inst Signals Sensors & Syst, Microsyst Engn Ctr, Sch Engn & Phys Sci, Edinburgh, Midlothian, Scotland;

Merlin Circuit Technol Ltd, Deeside, Clwyd, Wales;

Merlin Circuit Technol Ltd, Deeside, Clwyd, Wales;

Univ Greenwich, Fac Architecture Comp & Humanities, Dept Math Sci, London, England;

Univ Greenwich, Fac Architecture Comp & Humanities, Dept Math Sci, London, England;

Univ Greenwich, Fac Architecture Comp & Humanities, Dept Math Sci, London, England;

MCS Ltd, Midlothian Innovat Ctr, Roslin, Midlothian, Scotland;

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收录信息美国《科学引文索引》(SCI);美国《工程索引》(EI);
原文格式 PDF
正文语种 eng
中图分类
关键词
Electroplating; Copper; Printed circuit board; Acoustic streaming; Megasonic agitation;

机译：电镀;铜;印刷电路板;声流;中速搅拌;
入库时间 2022-08-18 01:16:57

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专利

1. Copper electroplating electroplating of PCB interconnects using megasonic acoustic streaming [J] . Jones Thomas D. A., Bernassau Anne, Flynn David, Ultrasonics sonochemistry . 2018,第期

机译：PCB互连电镀电镀使用兆声声物流互连
2. Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation [J] . S. Costello, N. Strusevich, D. Flynn, Microsystem technologies . 2013,第6期

机译：使用超音速搅拌将铜电沉积到高深宽比PCB微孔中
3. Megasonic agitation for enhanced electrodeposition of copper [J] . Jens Georg Kaufmann, Marc P. Y. Desmulliez, Yingtao Tian, Microsystem Technologies . 2009,第8期

机译：超声搅拌增强铜的电沉积
4. Surface morphology and residual stress of electroplated and electroless copper deposits [C] . K. G. Keong, W. Sha, Z. X. Quo, Fifth International Conference on Computer Methods and Experimental Measurements for Surface Treatment, 5th, 2001, Seville . 2001

机译：电镀和化学镀铜沉积物的表面形态和残余应力
5. Modeling and experimental validation of electroplating deposit distributions in copper sulfate solutions [D] . Robison, Mark Robert 2014

机译：硫酸铜溶液中电镀沉积物分布的建模和实验验证
6. Realization of an ultrathin acoustic lens for subwavelength focusing in the megasonic range [O] . Jaeyub Hyun, Yong Tae Kim, Il Doh, -1

机译：实现超音波透镜用于在超音速范围内进行亚波长聚焦
7. Copper electroplating of PCB interconnects using megasonic acoustic streaming [O] . Thomas D.A. Jones, Anne Bernassau, David Flynn, 2018

机译：PCB互连铜电镀使用兆声声流媒体
8. Pressure Waves Induced by Megasonic Agitation in a LIGA Development Tank [R] . Ting, A. 2002

机译：LIGa开发槽中超声波搅拌引起的压力波

Morphology and acoustic artefacts of copper deposits electroplated using megasonic assisted agitation

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