Studies on Adsorption Behavior and Mechanism of Copper (Ⅱ) onto Amino Methylene Phosphonic Acid Resin

摘要

The adsorption behavior and the mechanism of a novel chelate resin, amino methylene phosphonic acid resin (APAR) for Cu(Ⅱ) were investigated. Cu(Ⅱ) was quantitatively adsorbed by APAR in the medium of pH = 4.09. The statically saturated adsorption capacity is 181 mg/(g resin). Cu(Ⅱ) adsorbed on APAR can be eluted by 1. 0―3. 0 mol/L HCl. The rate constant is k_(298)=5.58 X 10~(-5)s~(-1). The adsorption of Cu(Ⅱ) on APAR follows the Freundlich isotherm. The ΔH of the adsorption is 3. 91 kJ/mol. The apparent activation energy is E_a = 21. 4 kJ/mol. The coordination molar ratio of APAR to Cu(Ⅱ) is 1/1. It I's shown that the nitrogen and the oxygen atoms in the functional group of APAR coordinate to Cu(Ⅱ).