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Self-assembling Process of Alkanethiol Monolayers on Gold Surface via Underpotential Deposition

机译:欠电位沉积法在金表面上烷硫醇单分子膜的自组装过程

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It was demonstrated feasible that underpotential deposition(UPD)of copper on a monolayer-modified gold substrate can be used to determine the gold electrode area.The deposition and stripping of a Cu adlayer can take place reversibly and stably at a bared or a self-assembled monolayer modified gold electrode.The growth kinetics of decane-thiol/Au was also investigated via Cu UPD.The difference between the assembling kinetics determined by UPD and that by quartz crystal microbalance measurements reveals the configuration transmutation of the assembled molecules from a disordered arrangement to an ordered arrangement during the self-assembling processes
机译:事实证明,在单层改性的金基底上铜的欠电位沉积(UPD)可以用于确定金电极面积.Cu沉积层的沉积和剥离可以在裸露或自生的情况下可逆且稳定地进行。组装的单层修饰金电极。还通过Cu UPD研究了癸烷-硫醇/ Au的生长动力学.UPD测定的组装动力学与石英晶体微量天平测量的组装动力学之间的差异揭示了组装的分子从无序排列转变而来的构型trans变在自组装过程中有序排列

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