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Strength characterization of silicon microprobes in neurophysiological tissues

机译:神经生理组织中硅微探针的强度表征

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摘要

Experimentally determined strength characteristics of thin-silicon probes in neural tissues are discussed. It is shown that by proper selection of the substrate length, width, and thickness, silicon substrates can be designed and used to penetrate a variety of biological tissues without breakage or excessive dimpling. Thin-silicon structures have a maximum fracture stress which is a factor of six larger than that of bulk silicon and are very flexible and capable of bending to angles larger than 90 degrees . Silicon substrates 15 mu m thick*30 mu m wide can easily penetrate guinea pig and rat pia arachnoid layers with minimum dimpling and no breakage, while substrates 30 mu m thick*80 mu m wide can penetrate guinea pig and rat dura mater repeatedly without breakage. Quantitative comparison on the relative toughness of neurophysiological tissues in rat and guinea pig have also been experimentally obtained.
机译:讨论了神经组织中实验确定的薄硅探针的强度特性。结果表明,通过适当选择衬底的长度,宽度和厚度,可以设计硅衬底并将其用于穿透各种生物组织而不会破裂或过度凹陷。薄硅结构的最大断裂应力比块状硅的最大断裂应力大六倍,并且非常柔软,能够弯曲到大于90度的角度。 15微米厚* 30微米宽的硅基板可轻松穿透豚鼠和大鼠皮层蛛网膜层,且凹陷最少且无破裂,而30微米厚* 80微米宽的硅基板可反复穿透豚鼠和大鼠硬脑膜而不会破裂。还通过实验获得了大鼠和豚鼠神经生理组织相对韧性的定量比较。

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