The 2009 edition of Nepcon China 2009, an exhibition of manufacturing equipment and technologies, centering on mounters or component placement machines and soldering materials and equipment, took place from April 21 to 24 at the Everbright Convention & Exhibition Center in Shanghai. About 450 companies from 22 countries and territories, including China, Japan, Taiwan, Singapore, the United States and countries in the European region, participated in the event.
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机译：4月21日至24日，在上海光大会展中心举行了2009年Nepcon China 2009展览会，该展览会以贴片机或元件贴装机以及焊接材料和设备为主要主题的制造设备和技术展览会。来自中国，日本，台湾，新加坡，美国和欧洲地区国家的22个国家和地区的约450家公司参加了此次活动。
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