PCBs Step up to Meet Demands in Emerging Fields

摘要

With the sophistication of printed circuit boards (PCBs), the development of new technologies and products targeted on growth fields has been gathering momentum. Advanced build-up technologies are employed in PCBs for use in smartphones and tablets. Component-embedded substrate and low-temperature co-fired ceramic (LTCC) substrate technologies are adopted in PCBs for highly functional modules. Many new technologies, including high heat-resistant PCBs and PCBs that can handle high current, have been developed targeted at growth fields, such as automobiles and photovoltaic (PV) power generation systems. Furthermore, the wiring freedom of flexible printed circuits (FPCs) has improved further.