Himax Technologies Clinches TDDI Solution Design-ins

摘要

Himax Technologies, Inc. has clinched design-ins with key panel makers and original equipment manufacturers (OEMs) for its best-in-class single-chip touch and display driver integration (TDDI) solution, HiSIT. In addition to the existing shipment of out-cell and on-cell solutions, Himax's HiSIT TDDI solution is ready for mass production and is expected to start shipping by the fourth quarter of 2015. HiSIT could lower system level costs for panel makers and simplify supply chain management for OEMs. This single-chip solution will help handset makers deliver thinner, lighter, and sleeker designs with significantly enhanced performance. The industry is seeking cost effective and innovative display and touch solutions for smartphones and tablets, and HiSIT offers an outstanding combination of Himax's highly recognized display driver and proven touch solution in a sophisticated structure that supports full in-cell touch displays for high-definition (HD) resolution smart-phones and WXGA resolution tablets.