Advanced Solutions Suit Semiconductor Chip Packaging

摘要

Senju Metal Industry Co., Ltd. (SMIC) has been making effective proposals of various solutions leveraging an extensive lineup of products on the back of its outstanding capabilities to develop materials. One of these products is the semiconductor packaging solution. SMIC deploys a comprehensive solution, encompassing its original solder pastes, solder balls, solder preforms, fluxes for semiconductors, factory automation (FA) equipment for semiconductor mounting, and furthermore, Injection Molded Solder (IMS) equipment, which forms bumps by injecting melted solder while applying pressure. With this comprehensive lineup of solutions, SMIC provides customers with new value proposition.