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Fujitsu, Qualcomm Partner on 5G Smartphone Reference Design

机译:富士通,Qualcomm合作伙伴5G智能手机参考设计

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摘要

Fujitsu Connected Technologies Limited (FCNT) has developed the thinnest 5G smartphone reference design (Photo 1) that supports both sub-6GHz and millimeter wave (mmWave) technologies utilizing the Qualcomm Snapdragon 865 5G Modular Platform. As commercial 5G service begins and local 5G is deployed at scale around the world in 2020, FCNT will utilize and apply this reference design to inexpensively develop and quickly commercialize 5G-enabled smart devices and solutions, meeting the needs of customers who are considering developing products or providing services that utilize 5G. 5G is a next-generation communications technology that offers ultra-high speed, high capacity, and low latency. It is expected to be used in a wide range of industries, including not only the ICT field, but also mobility and healthcare, among others. In order to further promote the use of 5G and increase the speed of 5G uptake, FCNT has combined the technology and know-how cultivated by FCNT and Qualcomm Technologies to develop the thinnest 5G smartphone reference design, with a thickness of just 7.6mm. At the same time, it also supports technically challenging mmWave communications, utilizing the Snapdragon 865 5G Modular Platform, in which the radio frequency (RF) front-end, the application processor, and the modem are all modularized.
机译:Fujitsu连接技术有限公司(FCNT)开发了可利用Qualcomm Snapdragon 865 5G模块化平台的Sup-6GHz和毫米波(MMWave)技术的最薄5G智能手机参考设计(照片1)。由于商业5G服务开始和本地5G在2020年在全球范围内部署,FCNT将利用和应用该参考设计,以廉价开发和快速商业化5G的智能设备和解决方案,满足正在考虑开发产品的客户的需求或提供利用5G的服务。图5G是一个提供超高速,高容量和低延迟的下一代通信技术。预计将用于广泛的行业,不仅包括ICT领域,而且包括流动性和医疗保健等。为了进一步推动5G,提高5G摄取的速度,FCNT通过FCNT和高通技术组合了技术和专业技术,以开发最薄的5G智能手机参考设计,厚度为7.6mm。同时,它还支持技术上具有挑战性的MMWAVE通信,利用Snapdragon 865 5G模块化平台,其中射频(RF)前端,应用处理器和调制解调器都是模块化的。

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    《Asia electronics industry》 |2020年第9期|18-19|共2页
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