A Micromechanics‑Based Hierarchical Analysis of Thermal Conductivity of Metallic Nanocomposites with Agglomerated Ceramic Nanoparticles

摘要

The influence of agglomeration of SiC nanoparticles on the bulk thermal conducting behavior of aluminum (Al)-basednanocomposites is examined using a micromechanics-based hierarchical technique. The interfacial thermal resistance (ITR)between the ceramic nano-scale particles and the metallic matrix is included in the analysis. The predictions of the micromechanicalmodel considering the agglomeration and ITR are in very good agreement with the available experimental results.The agglomeration of ceramic nanoparticles greatly reduces the thermal conducting coefficient of the Al-based nanocomposites.When the nanoparticle volume fraction is 10%, the thermal conductivity decreases from 132 to 115 W/mK with theformation of nanoparticle agglomeration. The uniform distribution of nanoparticles and the elimination of ITR can lead to asubstantial enhancement in the nanocomposite thermal conductivity. When the volume fraction is 10%, the thermal conductivityincreases from 115 to 188 W/mK by uniform dispersing the nanoparticles and removing the SiC/Al ITR. Moreover,the effects of amount, and diameter of nano-scale particles as well as the constituent material properties on the bulk thermalconductivity of the SiC nanoparticle-filled Al nanocomposites are examined. When the SiC diameter increases from 35 nmto 3.5 μm, the thermal conductivity of the Al-based composite increases from 132 to 173 W/mK.