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首页> 外文期刊>Applied Surface Science >Adsorption behavior of thiadiazole derivatives as anticorrosion additives on copper oxide surface: Computational and experimental studies
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Adsorption behavior of thiadiazole derivatives as anticorrosion additives on copper oxide surface: Computational and experimental studies

机译:噻二唑衍生物作为防腐添加剂在氧化铜表面的吸附行为:计算和实验研究

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Adsorption behavior of thiadiazole derivatives, 2,5-bis(ethyldisulfanyl)-1,3,4-thiadiazole (DTA), dimercapto-1,3,4-thiadiazole (DMDT) as anticorrosion additives at copper oxide surface were studied by first-principles calculations, weight loss, electrochemical and surface characterization techniques. The adsorption energies calculated by density functional theory (DFT) were less than 0.3 eV, DTA and DMDT physically adsorbed on the copper surface and cannot replace the oxygen atom at the top site of the Cu-O slab models. The predicted physically interaction of the corrosion inhibitor on the copper surface, which was basically consistent with the results of XPS analysis and surface microtopography. It was shown that in the presence of DTA and DMDT adsorbed on copper surface depress the reaction rate of anodic dissolution and cathodic hydrogen evolution and obey Langmuir isotherm. Surface findings indicated the inhibitor film formed at copper surface can block corrosion and improve hydrophobicity.
机译:首先,研究了作为防腐添加剂的噻二唑衍生物,2,5-双(乙基二硫烷基)-1,3,4-噻二唑(DTA),二巯基-1,3,4-噻二唑(DMDT)在氧化铜表面的吸附行为。原理计算,失重,电化学和表面表征技术。通过密度泛函理论(DFT)计算得出的吸附能小于0.3 eV,DTA和DMDT物理吸附在铜表面,不能替代Cu-O平板模型顶部的氧原子。腐蚀抑制剂在铜表面的预计物理相互作用,与XPS分析和表面微观形貌的结果基本一致。结果表明,在铜表面吸附有DTA和DMDT的情况下,阳极溶解和阴极析氢的反应速率降低,并遵守Langmuir等温线。表面发现表明,在铜表面形成的抑制剂膜可以阻止腐蚀并改善疏水性。

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