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首页> 外文期刊>Applied Surface Science >Microstructure and electrical properties of (Zr, Sn)TiO4 thin film deposited on Si(100) using a sol-gel process
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Microstructure and electrical properties of (Zr, Sn)TiO4 thin film deposited on Si(100) using a sol-gel process

机译:溶胶-凝胶法沉积在Si(100)上的(Zr,Sn)TiO4薄膜的微观结构和电性能

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摘要

Polycrystalline zirconium tin titanate (Zr0.8Sn0.2TiO4, ZST) thin films with thickness of 81 nm were deposited successfully along the (100) on a p-type Si substrate by an improved sol-gel method. The deposited films were crystallized when annealing temperature was up to 450 degrees C. The thickness and compositions of the interface layer between the ZST films and Si substrate were identified by high-resolution transmission electron microscope (HRTEM). The electrical properties such as leakage current density, flat-band voltage and capacitance of the films were measured and discussed. Furthermore, the mechanism of the leakage current was also investigated. (c) 2006 Elsevier B.V. All rights reserved.
机译:通过改进的溶胶-凝胶法成功地沿(100)在p型Si衬底上沉积了厚度为81 nm的多晶钛酸锆钛酸锆(Zr0.8Sn0.2TiO4,ZST)薄膜。当退火温度达到450℃时,沉积的膜结晶。通过高分辨率透射电子显微镜(HRTEM)鉴定ZST膜和Si衬底之间的界面层的厚度和组成。测量并讨论了薄膜的电学性能,例如漏电流密度,平带电压和电容。此外,还研究了泄漏电流的机理。 (c)2006 Elsevier B.V.保留所有权利。

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