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The interfacial structure of plated copper alloy resistance spot welded joint

机译:镀铜合金电阻点焊接头的界面结构

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摘要

Plated copper alloys are widely used in electron industry. The plating lay caused the farther decreasing of the welding property of copper alloys, whose intrinsic weldability was poor. In this paper, the bronze and brass specimens with nickel-tin double plating layer were joined by resistance spot welding method. The microstructure and peel strength of the joints were investigated. The experiment results show that a sandwich-like structure was obtained in the faying surface after welding, and the nickel plating layer thickness had severe effect on the reliability of the joints.
机译:电镀铜合金广泛用于电子工业。镀敷层使铜合金的焊接性能进一步降低,其固有焊接性较差。本文采用电阻点焊的方法对镀镍锡双镀层的青铜和黄铜试样进行了连接。研究了接头的微观结构和剥离强度。实验结果表明,焊接后的接合面得到了三明治状的结构,镀镍层的厚度对接头的可靠性产生了严重的影响。

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