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Microstructure, Porosity And Roughness Of Rf Sputtered Oxide Thin Films: Characterization And Modelization

机译:射频溅射氧化薄膜的微观结构,孔隙率和粗糙度:表征和模型化

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Spinel CoMnFeO_4 thin films are stable materials useful to study the influence of radio-frequency (RF) sputtering experimental conditions on the microstructure of oxide films. It has been demonstrated by various techniques such as electronic and atomic force microscopy (AFM), gas adsorption techniques and ellipsometry, that films prepared with 0.5 Pa sputtering argon pressure and 5 cm target-substrate distance are very dense. On the other hand, the samples obtained under higher pressure and/or longer distances are microporous with a mean pore size generally lower than 2 nm. The specific surface areas of such films reach about 75 m~2/g.rnAccording to the simple model proposed, the films are made of three layers. From the bottom to the top of the film, the first one at the interface with the substrate is 100% dense. The second layer is made of cylindrical rods set up according to a compact plane. Its porosity is due to the lattice interstices. Hemispheric domes covering each rod make up the third layer, which displays a degree of roughness related to the shape and the hexagonal arrangement of the domes. The surface enhancement factor (SEF), the porosity and roughness, calculated from the model, are in corroboration with the experimental values. The porosity factor is however slightly underestimated by the model for very porous samples.
机译:尖晶石CoMnFeO_4薄膜是稳定的材料,可用于研究射频(RF)溅射实验条件对氧化膜微结构的影响。通过各种技术,例如电子和原子力显微镜(AFM),气体吸附技术和椭圆偏振法已证明,用0.5 Pa溅射氩气压力和5 cm靶-基片距离制备的膜非常致密。另一方面,在较高压力和/或较长距离下获得的样品是微孔的,平均孔径通常低于2 nm。这种膜的比表面积达到约75m 2 / g。根据所提出的简单模型,膜由三层制成。从薄膜的底部到顶部,与基材交界处的第一个是100%致密的。第二层由根据紧凑平面设置的圆柱杆制成。其孔隙率是由于晶格间隙。覆盖每个杆的半球形圆顶构成第三层,该第三层呈现出与圆顶的形状和六边形排列有关的粗糙度。根据模型计算得出的表面增强因子(SEF),孔隙率和粗糙度与实验值相符。然而,对于非常多孔的样品,该模型的孔隙率因子略有低估。

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