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Modification Of H-terminated Ge Surface In Hydrochloric Acid

机译:盐酸中氢封端锗表面的修饰

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Various amounts of H-termination on a Ge surface were prepared by dipping a Ge wafer in differentially diluted hydrofluoric acid solutions for different periods of time. Formation of Ge-H_x in hydrofluoric acid and its disappearance in hydrochloric acid (HC1) were directly measured by using multiple internal reflection Fourier transform infrared spectroscopy (MIR FT-IR). Peak intensity of Ge-H_x vibration mode was increased with diluted hydrofluoric acid (DHF) treatment time and the concentration of HF solution. Therefore, it is suggested that microroughness of a Ge surface changes depending on the concentration of HF. Peak intensity of Ge-H_x vibration mode was reduced when the Ge-H_x surface was treated in HCl solution. With an increase in HCl treatment time, peak intensity of Ge-H_x vibration mode was reduced. Ge surfaces treated in a more diluted HF solution were barely modified, because it was thought to have fewer kink sites, dihydrides and trihydrides.
机译:通过将Ge晶片浸入差异稀释的氢氟酸溶液中不同的时间,可以在Ge表面制备各种量的H端接。使用多次内反射傅里叶变换红外光谱法(MIR FT-IR)直接测量了氢氟酸中Ge-H_x的形成及其在盐酸中的消失。 Ge-H_x振动模式的峰值强度随着稀氢氟酸(DHF)处理时间和HF溶液浓度的增加而增加。因此,建议Ge表面的微观粗糙度根据HF的浓度而变化。当在HCl溶液中处理Ge-H_x表面时,Ge-H_x振动模式的峰值强度降低。随着HCl处理时间的增加,Ge-H_x振动模式的峰值强度降低。在更稀的HF溶液中处理过的Ge表面几乎未改性,因为人们认为它的扭结点,二氢化物和三氢化物较少。

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