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Preparation of monodisperse polystyrene/silica core-shell nano-composite abrasive with controllable size and its chemical mechanical polishing performance on copper

机译:尺寸可控的单分散聚苯乙烯/二氧化硅核壳纳米复合磨料的制备及其对铜的化学机械抛光性能

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摘要

Monodisperse silica-coated polystyrene (PS) nano-composite abrasives with controllable size were prepared via a two-step process. Monodisperse positively charged PS colloids were synthesized via polymerization of styrene by using a cationic initiator. In the subsequent coating process, silica formed shell on the surfaces of core PS particles via the ammonia-catalyzed hydrolysis and condensation of tetraethoxysilane. Neither centrifugation/water wash/redispersion cycle process nor surface modification or addition surfactant was needed in the whole process. The morphology of the abrasives was characterized by scanning electron microscope. Transmission electron microscope and energy dispersive X-ray analysis results indicated that silica layer was successfully coated onto the surfaces of PS particles. Composite abrasive has a core-shell structure and smooth surface. The chemical mechanical polishing performances of the composite abrasive and conventional colloidal silica abrasive on blanket copper wafers were investigated. The root mean square roughness decreases from 4.27 nm to 0.56 nm using composite abrasive. The PS/SiO_2 core-shell composite abrasives exhibited little higher material removal rate than silica abrasives.
机译:通过两步法制备尺寸可控的单分散二氧化硅涂层聚苯乙烯(PS)纳米复合磨料。通过使用阳离子引发剂使苯乙烯聚合来合成单分散带正电的PS胶体。在随后的涂覆过程中,二氧化硅通过氨催化的四乙氧基硅烷的水解和缩合在核PS颗粒的表面上形成壳。在整个过程中既不需要离心/水洗/再分散循环过程,也不需要表面改性或添加表面活性剂。用扫描电子显微镜表征磨料的形态。透射电子显微镜和能量色散X射线分析结果表明,二氧化硅层成功地涂覆在PS颗粒的表面上。复合磨料具有核-壳结构和光滑的表面。研究了复合磨料和常规胶态二氧化硅磨料在毯式铜片上的化学机械抛光性能。使用复合磨料,均方根粗糙度从4.27 nm降低至0.56 nm。 PS / SiO_2核壳复合磨料的材料去除率比二氧化硅磨料高。

著录项

  • 来源
    《Applied Surface Science》 |2011年第3期|p.1217-1224|共8页
  • 作者单位

    State Key Laboratory of Functional Materials for Informatics, Laboratory of Nanotechnology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, China,Shanghai Xinanna Electronic Technology Co., Ltd., Shanghai 201506, China,Graduate School of the Chinese Academy of Sciences, Beijing 100049, China;

    State Key Laboratory of Functional Materials for Informatics, Laboratory of Nanotechnology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, China,Shanghai Xinanna Electronic Technology Co., Ltd., Shanghai 201506, China,Graduate School of the Chinese Academy of Sciences, Beijing 100049, China;

    State Key Laboratory of Functional Materials for Informatics, Laboratory of Nanotechnology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, China,Shanghai Xinanna Electronic Technology Co., Ltd., Shanghai 201506, China,Graduate School of the Chinese Academy of Sciences, Beijing 100049, China;

    State Key Laboratory of Functional Materials for Informatics, Laboratory of Nanotechnology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, China,Shanghai Xinanna Electronic Technology Co., Ltd., Shanghai 201506, China;

    State Key Laboratory of Functional Materials for Informatics, Laboratory of Nanotechnology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, China,Shanghai Xinanna Electronic Technology Co., Ltd., Shanghai 201506, China;

    State Key Laboratory of Functional Materials for Informatics, Laboratory of Nanotechnology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, China,Shanghai Xinanna Electronic Technology Co., Ltd., Shanghai 201506, China;

  • 收录信息
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    PS/SiO_2; core-shell; nano-composite abrasive; copper; chemical mechanical polishing;

    机译:PS / SiO_2;核 - 壳;纳米复合磨料;铜;化学机械抛光;
  • 入库时间 2022-08-18 03:07:10

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