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Metal-assisted electroless etching of silicon in aqueous NH4HF2 solution

机译:NH4HF2水溶液中金属的化学辅助硅化学腐蚀

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摘要

One-step and two-step metal-assisted electroless chemical etchings of p-type silicon substrate in new solutions were investigated. In the one-step etching process, the etching is performed in NH_4HF_2/AgNCO_3 solution. On the other hand, the two-step etching process involves chemical deposition of noble metal onto silicon substrate surface followed by electroless etching in NH_4HF_2/H_2O_2 solution. The effect of several parameters on the morphology of etched layer was studied namely: pH of etching solution for the two cases and the etching temperature, the concentration of NH4HF2 and the type of metal deposited on silicon surface for second case. It is shown that the morphology depends strongly on etching parameters where different nanostructure shapes can be formed. An important result is that silicon nanowires are formed at pH = 4 and pH < 2 for the first and second case, respectively.
机译:研究了在新溶液中对p型硅衬底进行的一步和两步金属辅助化学蚀刻。在一步蚀刻工艺中,蚀刻是在NH_4HF_2 / AgNCO_3溶液中进行的。另一方面,两步蚀刻工艺包括将贵金属化学沉积到硅衬底表面上,然后在NH_4HF_2 / H_2O_2溶液中进行化学蚀刻。研究了两种参数对蚀刻层形貌的影响:两种情况下的蚀刻溶液的pH值,第二种情况下的蚀刻温度,NH4HF2的浓度和沉积在硅表面的金属类型。结果表明,形态在很大程度上取决于蚀刻参数,在蚀刻参数中可以形成不同的纳米结构形状。一个重要的结果是,在第一种情况和第二种情况下,硅纳米线分别在pH = 4和pH <2时形成。

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